The BeagleBoard organisation has introduced a 4Top/s-capable AI processor in Raspberry Pi form factor, built around a Texas Instruments AM67A vision processor. Called a link to suitable Debian XFCE Linux distribution, it “AM67A features a quad-core 64bit Arm CPU subsystem, two general-purpose DSPs and matrix-multiply-accelerators, GPU, vision and deep learning accelerators, and multiple Arm Cortex-R5 cores for low-latency GPIO control”, ...
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The latest Electronics Weekly product news, ranging from Analogue and Asics to Software and Test.
PA Consulting names date for 2024 Raspberry Pi competition for schools
PA Consulting has announced the date for its nationwide Raspberry Pi competition Awards Day, for students aged 8-18: it will be held on Wednesday 1 May 2024. This year’s theme is to ‘improve health and well-being, at home, office, school or on the move’, and the venue will be at the Google offices in Pancras Square, London. With the aim ...
5 x 9mm inductor handles 200A
ITG Electronics is aiming at server motherboards and storage devices with a series of high-current surface-mount ferrite inductors. The SLA36385A series has a 5 x 9mm footprint and 9.5mm height, and yet the components can handle up to 230A. Inductances range across 35 to 470nH. “The 35nH component can handle more than 200A, with approximately 20% roll off”, said the ...
Surface-mount industrial M12 connectors
Binder has announced surface-mount M12 circular connectors. “They are suitable for processing in fully automated processes, such as for the particularly dense, double-sided assembly of PCBs,” it said. They are available “in blister or tape and reel packaging for automated processing”. Versions with 4, 6 and 8 contacts and with different codings are being offered, in both shielded and unshielded ...
80W or 2A reed relay on 0.25in pitch
Pickering Electronics has introduced a single-in-line reed relay family that mounts on a 0.25inch pitch while switching 80W or 2A. Called Series 144, they feature sputtered ruthenium contacts so they can switch at high power and low-level signals. There is also an internal mu-metal screen to eliminate magnetic interaction between closely stacked devices. Maximum carry current is 3A in all ...
Farnell signs Alliance Memory
Farnell has signed a global distribution agreement with Alliance Memory, bringing a significant new supplier to Farnell’s semiconductor portfolio. The complete range of Alliance Memory’s SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs will now be available from Farnell. “This welcome introduction of Alliance Memory’s extensive memory solutions to our global line card will help our customers worldwide ...
Quadsat antenna testing range adds frequencies, uplink capabilities
Quadsat, the Danish drone-based antenna testing company, has launched its product range with an extended breadth of frequency ranges and the addition of uplink capabilities. The Quadsat range for RF measurement comprises: QS 1-18 DL (downlink tests, covering S-KU band), QS 6-24 DL (downlink tests, X – KA low band), QS 17-31 DL (downlink, KA band), QS 6-24 DL/UL (downlink ...
Xmos adds Audio Weaver to design tool suite
Xmos has teamed up with audio software specialist DSP Concepts to add graphical audio and voice processing design software to development tools for xcore.ai audio processing ICs. Audio Weaver is the drag-and-drop graphical design software. “DSP Concepts has ported their platform software, AWE Core [embedded processing engine], on to xcore.ai platform that runs along with Xmos platform software,” Xmos told ...
Renesas dips toes into few-pin RISC-V MCUs
Resasas has put its in-house developed 32bit RISC-V core into a few-pin general-purpose MCU series, following earlier RISC-V projects with Anders and SiFive. Announced last November, the core implementation can accommodate various standard RISC-V options, to which Renesas has added its own options including: a stack monitor register to protect against rogue software, a dynamic branch prediction unit improve the ...
Small top-side cooled automotive mosfets keep heat out of the PCB
Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...