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Tag Archives: Embedded World

Embedded World: AMD’s 4th generation EPYC embedded processors

AMD EPYC Embedded_9004_block

AMD announced its 4th generation EPYC embedded processors at Embedded World today, using its ‘Zen 4’ architecture and aimed at embedded networking, security, firewalls and storage in cloud and enterprise computing, as well in factory floor industrial edge servers. There are 10 processors in the Embedded 9004 Series, made using a 5nm chip process, with 16 to 96 cores see ...

Embedded World: Authentication companion ICs for MCUs

Miceochip secure element ICs

At Embedded World today, Microchip announced six secure authentication devices that meet Common Criteria Joint Interpretation Library (JIL) secure key storage, and support algorithms that comply with the Federal Information Processing Standard (FIPS). They are intended to be companion devices, compatible with any microprocessor or microcontroller. “This portfolio lowers the barrier to entry and enables developers of products for new ...

Embedded World: Automotive Bluetooth LE MCU

Onsemi automotive Bluetooth MCU ONSPR3423

Onsemi announced an automotive-grade Bluetooth Low Energy wireless microcontroller, intended to reduce the weight of sensor cabling in vehicles. “Excelling at applications such as vehicle access and tire monitoring systems, the miniature size of NCV-RSL15 makes it perfectly suited for portable remote access devices and in-tire and in-vehicle locations,” said Onsemi industrial solutions v-p Michel De Mey. Arm CryptoCell is ...

Embedded World: Harvesting NFC receiver for smart things

Infineon NGC1081 NFC receiver thermostat example

Infineon has created an IC to embedded in things that need to be controlled by a near-by mobile phone, which has in-built sensing and a motor driver. “Potential applications range from medical patches and disposable point-of-case testers, to data loggers, smart thermostats, smart locks and sensor inlays,” according to the company. Called NGC1081, the IC can be temporarily powered by ...

Headed to Embedded World?

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Embedded World returns to its more conventional diary slot (14-16 March) in Nuremberg, Germany. There are exhibitors in halls 1, 2, 3, 3A, 4 and 4A, covering application software and systems, embedded design, IC and IP design, M2M, safety and security, displays and startups. Caroline Hayes has curated some highlights to look for. One of the themes for Embedded World ...

Embedded World: Seco i.MX 93 computer-on-module

Seco-Maury-sbc

At Embedded World next week, Seco will be showing an i.MX 93 computer-on-module compliant to SMARC release 2.1.1. Called Maury, its NXP processor has on board: Arm Cortex-A55, Cortex-M33 and Ethos-U65  – the last one a neural network processor. “As an NXP Early Access Program participant and an NXP Gold Partner, Seco started development of Maury before the general availability ...

Talking Points: Jess Isquith of PICMG, on COM-HPC, COM Express and open specifications

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At Embedded World 2022 in Nuremberg we took advantage of the show to interview Jess Isquith, President of PICMG. Talking points in the interview include Computer-on-Modules and carrier cards, the COM-HPC specification, bridging the gap with COM Express, and processor agnostic open specifications. Thank you to Jess for her time. See all our Embedded World 2022 coverage » Founded in ...

Talking Points: Zeljko Loncaric of Congatec, on COM-HPC, maker boards and the Edge

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At Embedded World 2022 in Nuremberg we took advantage of the show to interview Zeljko Loncaric, a Marketing Engineer at Congatec. Talking points in the interview include computer-on-modules and COM-HPC, moving beyond maker boards, listening to the customer, and working at the Edge. Thank you to Zeljko for his time. Read all our Embedded World 2022 coverage » Congatec is ...

Talking Points: Ansgar Hein of SGET, on COMs, standards evolution and miniaturisation…

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At Embedded World 2022 in Nuremberg we took advantage of the show to interview Ansgar Hein, the Chairman of SGET. Talking points in the interview include the role of SGET, the main advantages of computer-on-modules (COMs), the evolution of standards and miniaturisation, and what the future holds. Thank you to Ansgar for his time. Read all our Embedded World 2022 ...

Talking Points: Ina Schindler of MicroSys, on automotive processors, AI, component longevity…

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At Embedded World 2022 in Nuremberg we took advantage of the show to interview Ina Schindler, the Managing Director of MicroSys. Talking points in the interview include automotive processors, the longevity of components, automotive processors, the use of AI and remaining supply chain issues. Thank you to Ina for her time. Read all our Embedded World 2022 coverage » MicroSys ...