Electronics Weekly Electronics Design & Components Tech News
RAMP is a programme established by the US Department of Defense (DoD) to develop secure design and prototyping capabilities to demonstrate how the DoD can securely leverage state-of-the-art microelectronics technologies without depending on a closed-security architecture fabrication process or facility.
In 2020, the DoD designated Microsoft as a central RAMP partner, as the DoD looked to leverage commercial industry expertise to modernize practices. Siemens has long been Microsoft’s lead partner for enabling EDA in the cloud, and as part of the RAMP Phase II program, this collaboration extends into secure, cloud-based environments also built on the Microsoft Azure Government platform.
Siemens‘ contribution to RAMP Phase II will initially focus on physical or “back-end” IC design via Siemens‘ Calibre platform, as this part of design creation is particularly challenging due to tight coupling of design techniques with the specific wafer fabrication processes targeted.
