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Specifically, it will support broadband connections for moving vehicles and Internet access for unconnected places, whether remote rural locations or disaster zones.
The company says the chip in development will enable user terminals that track the relative movement of low-earth orbit (LEO) satellites, allowing users to access high bandwidth connectivity.
The contract has been awarded through ESA’s Advanced Research in Telecommunications Systems Core Competitiveness programme (“ARTES CC“), with the support of the UK Space Agency (UKSA). The value of the contract is €5 million, with 75% being co-funded by the programme.
“The sizeable satellite communications market is a growth driver for our business, and we are delighted to be continuing our successful partnership with both UKSA and ESA to further develop innovative semiconductor solutions for the next generation of satellite broadband user terminals,” said the CEO of EnSilica, Ian Lankshear (pictured).
“Given the high number of chips per antenna, and the millions of users that could adopt these services, the potential growth within this market could be significant for our business in the medium term.”
UK Space Agency
Henny Sands, Head of Telecoms at the UK agency, described EnSilica’s satellite broadband user terminals chip as “a brilliant example of the diversity of expertise in the UK’s leading satellite communications sector”:
“Through the ARTES CC programme the UK Space Agency aims to champion UK companies that have the right expertise and ambition to become global players in this market and lead on ground-breaking technologies that will enhance the wider UK space sector, create jobs and generate further investment.”
“That’s why we recently announced £50 million of funding for ambitious and innovative projects that will supercharge the UK’s satellite communications industry.”
See also: EnSilica grows new Bristol design centre
