Arteris is supporting Armv9 automotive cores and ASIL D functional safety with release 3.6 of its Ncore cache coherent network-on-chip. “In 2020, Arteris announced a partnership with Arm and the alignment of our roadmaps to support CHI-E and ASIL B and ASIL D safety,” Arteris told Electronics Weekly. “We confirm the expansion of that partnership with a pre-validation of our ...
Red Semiconductor and Crypto Quantique have signed a memorandum of understanding for the development of an edge computing microprocessor IC “enabling advanced quantum-based security”, according to the companies. Red is a fabless semiconductor company and Crypto Quantique has physically un-cloneable security intellectual property – both are based in the UK. “The chips, created by Red Semiconductor, will use Crypto Quantique’s ...
Rohm has developed a 30mW artificial intelligence IC with on-device learning capability for edge processing – 30mW here is an example power, dependent on algorithm running. “Until now it has been difficult to develop AI chips that can learn in the field consuming low power,” according to the company. This one is intended to use “artificial intelligence to predict failures ...
Analog Devices, has introduced millimetre wave (mmW) 5G front-end chipsets spanning 24 to 47GHz. There are two 16-channel dual-polarisation beam formers and two single channel (one Tx + one Rx) up-down converters. ADMV4828 24 – 29.5GHz 16-channel beamformer >12.5dBm output at 3% EVM with 400MHz 64QAM 5G NR waveform 310mW/channel ADMV4928 37 to 43.5GHz 16-channel beamformer >11.5dBm output at 3% EVM ...
Energy harvesting IC company e-peas announced an Arm Cortex-M0 microcontroller at CES this week that it claims will consume only 18µA/MHz in active mode. Called EDMS105N, the 32bit 24MHz device is claimed to be “the lowest power consuming Cortex-M0 MCU to be commercially available”, said the company. Amongst the sleep states is one which draws 340nA with its real-time clock running and ...
Smiths Interconnect has introduced a production probe head for wafer-level packages and known good die. Part of its Volta range Volta 180 is a WLCSP test connector for chips with 180um pitch IO. The series is capable of testing sorted die for engineering development or failure analysis, and is an alternative to cantilever and vertical probe card technologies. Spring probe contacts ...
Smiths Interconnect is using system simulation models to create custom heat removal lids for ICs under test. “Traditional solutions including finned and liquid cooled heatsinks have been industry staples for many years but are limited in the amount of power they can support,” according to the company. “Smiths Interconnect has refined these options by introducing a liquid-cooled lid integrated with ...
Netherlands energy harvesting chip firm Nowi has added further cash to its Series A funding
High-performance chips can be designed to fail early, or can be physically attacked using high workloads, according to Washington State University, whose research team damaged an on-chip comms network by deliberately adding malicious workload. Led by engineers Partha Pande (left) and Janardhan Rao Doppa, the team has been exploring chip vulnerabilities as a way to prevent malicious attacks, and decided to have ...
Accelerator on a Chip International Program aims to create an electron accelerator on a silicon chi
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