Hirose of Japan and Harting of Germany are to develop a miniature connection for 10Gbit Ethernet. “As a form of the Internet of Things, there is one thing that Industry 4.0 requires above all else: an Ethernet connection to each and every Industry 4.0 component,” claimed Harting chairman Philip Harting. “The standardisation and international norms for new high-performance components and ...
Communications
Sigfox chip integrates transmitter and receiver
Atmel’s ATA8520D is a transceiver IC for 868MHz Sigfox proprietary networks, intended to be used for IoT and machine-to-machine comms with the Sigfox protocol. It has an RF front end for up and down-link , a digital baseband and a microcontroller in the same device. The transmit path uses a closed loop fractional-N modulator, while a serial peripheral interface (SPI) ...
Infineon enables NFC payment ring
"Proximity payments based on NFC technology are clearly on the rise – and payment solutions with smart wearables will accelerate this trend," says Infineon's Thomas Rostek.
AutoNaut autonomous boat listens to noisy ocean
Plymouth University is working with AutoNaut of Sussex on an autonomous wave-propelled boat to monitor sound levels in the ocean.
SSTL sells satellite to Honeywell
Surrey Satellite Technology (SSTL) has signed a contract with Honeywell to supply a satellite to demonstrate the two-way VHF Data Exchange System (VDES) payload for the exactEarth maritime satellite constellation. Called the Vesta satellite, the deal is part of a memorandum of understanding Honeywell Aerospace and the UK Space Agency. It is a configuration of the SSTL-12 satellite platform, aimed at missions of ...
Ceva unveils IP for first 5G smartphone chips
Processor IP firm Ceva will unveil technology for next-generation silicon chipsets for LTE-Advanced Pro and 5G smartphones later this month at the Linley Mobile & Wearables Conference in Santa Clara, California. Linley Gwennap, principal analyst of the Linley Group, writes: “Ceva has a long and successful heritage in DSP IP for LTE, and in fact, powered the first-ever LTE phone launched ...
Leti 3D network-on-chip uses active interposer
French semiconductor research lab has developed a 3D network-on-chip (3D-NoC) for fast computing. It is intended to be used to transfer data between stacked die, or across an array of die on a silicon interposer. “The steady rise in the number of applications that require high-performance computing creates a demand for new hardware-plus-software communications solutions that improve both performance and ...
NI gives programmable PXIe module 1GHz bandwidth for 5G
NI has introduced a programmable PXIe module which is a vector signal transceiver with a 1GHz bandwidth. It is a 6.5GHz RF vector signal generator and analyser which can be programmed using LabVIEW to create specific designs or test configurations. The NI PXIe-5840 VST has a user-programmable FPGA with high-speed serial and parallel digital interfaces in a single 2-slot PXI ...
Qualcomm powers new quad-core Snapdragon for VR
Qualcomm Technologies has announced its latest smartphone processor, a higher performance follow-up to the Snapdragon 820 processor. The expectation is that the new Snapdragon 821 processor will have extra performance to support mobile virtual reality (VR) displays. The Snapdragon 821 is claimed to provide a 10% performance increase over the 820 with the Qualcomm Kryo quad-core CPU, reaching speeds up to ...
10Gbit/s wireless link in London
RF Com is to demonstrate a 10Gbit/s point-to-point wireless link across London in August, using millimetre-wave equipment from microwave firm Elva-1. Intended for 4G and LTE telecoms back-haul, the link can also bridge fibre-optic cables across rivers and sensitive areas like historic town centres, RF Com MD Ian Cains told Electronics Weekly. Corporate campus networks, IPTV, wireless ISP backbone and last-mile ...