The next edition of the 3GPP 5G Advanced standard (Release 19) is expected to bring ambient IoT within 6G to increase connectivity from billions of devices to trillions. Voting in December, the telecom companies and mobile operators that make up 3GPP membership will define what is to be in the latest standard. “Ambient IoT will almost certainly be part of ...
NI is teaming up with mobile phone giant Samsung Electronics to develop 5G test UEs for proposed 5G New Radio (NR) radio interface. The first public demonstration of this collaboration will show Samsung’s 28GHz basestation communicating with an NI test UE at next week’s Mobile World Congress (February 26 to March 1) in Barcelona. A first draft of the 5G ...
Multi-band, multi-standard transceiver chip specialist, Lime Microsystems, has signed Taiwan-based Azio Electronics as its strategic distribution partner for the Greater China region. The deal, which is effective immediately, will give Lime’s customers in mainland China, Taiwan and Hong Kong a greater level of support and access to Lime’s complete portfolio of multi-band, multi-standard transceiver based products. “We were impressed by the ...
Belgian research lab IMEC and Renesas have revealed a reconfigurable transceiver that eliminates the need of surface acoustic wave (SAW) filters. The development is part of IMEC's Scaldio reconfigurable radio programme, and was...
From facilitating mobile internet access to enabling TV on the move, mobile networks are experiencing an inexorable rise in demand for data services. At a time when high-speed wireline broadband services now reach so many homes, it is only natural for consumers to expect wireless broadband to follow suit, and due to the Third Generation Partnership Project (3GPP) and other ...
PicoChip and mimoOn have successfully tested a 3GPP LTE femtocell reference design using Agilent Technology’s MXA signal analyser and vector signal analyser. “LTE is the next market for picoChip,” said Guillaume d’Eyssautier, president and CEO, picoChip. According to d’Eyssautier: “It is crucial that we continue to leverage that at every stage. Simply put, the two-year experience lead that we have ...
Future electronic systems will combine multiple communications protocols, according to executives from Freescale Semiconductor at its Technology Forum in Orlando
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