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Tag Archives: heat sink

16x GaN power boost with diamond heat extraction

RTX-DARPA-THREADS Raytheon high-power-density GaN

DARPA has awarded Raytheon a $15m four-year contract to increase the power density of GaN power devices in military radar. “The improved transistors will have 16 times higher output power than traditional Gallium Nitride with no increase in operating temperature,” according to the company. “Thermal management is no longer a limiting factor,” added Raytheon president Colin Whelan. Key to this ...

Updated: Current-induced cooling shifts heat with ‘ionocaloric Stirling cycle’

Berkely ionocaloric cycle phase diag

Shunting ions around with electricity could produce enough heat transfer to replace greenhouse gas compression in domestic refrigerators, according to the US Lawrence Berkeley National Laboratory (LBL). The technology has been dubbed ‘ionocaloric cooling’. While warming and cooling a solid, liquid or gas can be used to shift some heat, much more can be shifted by a ‘phase change’ – ...

Seeking insulators that conduct more heat

UofTexasAtAustin insulation

Better component packaging and power grid performance is the aim of a search for thermally-conductive electrically-insulating materials at the University of Texas at Austin. “The key problem we’ve identified, is that improving thermal conductivity alone is not good enough,” said Austin thermal fluids researcher Vaibhav Bahadur. “You need a more holistic understanding of materials to meet electrical, thermal and mechanical ...

Peltier coolers are all under 10 x 10mm

Tiny-Peltier-modules

CUI has announced some small Peltier modules for extracting heat from tight spots. Branded Micro Peltier Modules, and all under 10 x 10mm, they vary in dimensions between 3.4 and 9.5mm acorss and can be an short as 1.95mm. The single-stage parts can achieve 50°C temperature difference, and have Qmax ratings between 0.2 and 4.7W at 50°C. Currents are from 0.7 to ...

Nanotube’s cut thermal resistance of heatsink interface

FujitsuLabs-CNT-thermal-interface-material-diag-crop

Fujitsu Laboratories has created a thin flexible adhesive sheet thermal interface material for heatsinking that achieves up to 100W/mK thermal conductivity. “Unlike previous technologies, the carbon nanotube adhesive sheets are also flexible, making them easy to cut and handle for use on variety of surfaces,” according to the lab. “This technology promises to deliver practical improvements and cost-effectiveness for power modules for ...

DC/DC drives 36A from 16x16mm package

4630-300x200.jpg

Linear Technology’s latest  DC/DC µModule voltage regulator has a single 36A output capable of delivering up to 144A when four devices are current shared. The LTM4630 DC/DC step-down regulator comes in a 16mm x 16mm x 4.41mm LGA package, which includes inductors and mosfets. According to the supplier, the efficiency for 36A at 1VOUT, from 12VIN is 86% and from 5VIN, is 88%. “With no ...

LED Engin pushes UV emitter technology

21aug13LedEnginUV365nm-400-300x200.jpg

LED Engin is claiming the world’s highest UV flux from a small package with its latest 365nm LED. The Californian company specialises in extracting a lot of heat from LED die in small packages using proprietary heatsinking techniques. Aimed at UV curing – the acceleration of organic chemical reactions – in inks, adhesives and coatings for example – LZ1-00UV00 typically ...

Apple patents indicate slimmer battery tech, curved for wrist

Apple-patent-for-curved-battery-300x200.jpg

Graphene, the wonder material whose glittering array of electrical and thermal properties won its discoverers a Nobel prize in 2010, could soon be helping Apple’s iPhones and iPads pack more power. The company has filed a US patent application (2013/0136966) on a graphene-based heat sink for the lithium batteries and circuit boards in its tablets and smartphones. Graphene is a ...