Industrial grade cellular comms SIM is 2.5 x 2.7mm for IoT and M2M

Infineon is claiming a first, with an industrial-grade embedded SIM (eSIM) in a 2.5 x 2.7mm wafer-level chip-scale package (WLCSP).

Infineon-WLCSP-eSIM-M2M-514

It is aimed at machine-to-machine comms and IoT applications, for example vending machines, remote sensors and asset trackers.

“Providing robust quality on a miniature footprint that works even under harshest conditions remains a challenge for silicon providers,” said the firm.


Called ‘SLM 97 security controller’, the SIM operates across -40 to 105°C and is “compliant with the latest GSMA specifications for eSIM”, said Infineon (eSIM = embedded SIM).


They also comply with embedded SIM (eUICC) specifications according to ETSI, and include set of hardware crypto-coprocessors supporting all relevant crypto schemes and supports Common Criteria EAL 5+ high certification.

There are two versions, both with ISO 7816 interfaces, 32bit Arm SecurCore SC300 processors and 32kbyte of ram: SLM 97CF1M00PE has 1Mbyte of non-volatile memory and CF6000PE has 608kbyte.

“Device manufacturers can simplify manufacturing processes as well as global distribution thanks to a single stock-keeping unit,” said the firm. “Customers also have the possibility to change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from the mobile operator.”

The part is made in Germany.

Not available is such a small package, there is an automotive version called SLI 97 which has AEC-Q100 qualification and
PPAP documentation.

It comes in the standard embedded M2M form (MFF2), and VQFN-32.


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