Better-than-TO247 top-side-cooled SMD package for 650V auto mosfets

Infineon has put 650V mosfet die from its CFD7A portfolio into a surface-mount package with “improved electrical performance over the well-known TO247 through-hole devices, thus enabling efficient energy utilisation in onboard chargers and dc-dc converters”, it said.

‘QDPAK TSC’ is a top-side-cooled package (see images) announced earlier this year and now registered with JEDEC – at the same time it revealed something similar for TO220 called DDPAK.

Picking the 650V 17mΩ (max) IPDQ65R017CFD7A, it can carry 86A at 100°C (136A at 25°C) and operate with its junction between -40 and +125°C.

Junction to case resistance is 0.18°C/W and up to 694W can be dissipated at 25°C.

Total gate charge is 236nC at 400V 61.6A drain and 0-10V gate. A separate source connection is provided for gate drive to aid switching.