Tag Archives: heatsink

Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...

EPC is claiming “the lowest on-resistance GaN FET on the market” for its 1mΩ 100V EPC2361, which comes in a 3 x 5mm QFN package with top and bottom cooling. 1mΩ is at 50A 25°C with 5V on the gate, and rises to ~1.8mΩ at the max operating temperature of 150°C (minimum is -40°C). The preliminary data sheet has no ...

Alpha and Omega has announced a double-side-cooled 100V 197A (25°C) mosfet in a 5 x 6mm DFN package. Called AONA66916, thermal resistance form the junction to the top and bottom surfaces is 0.5 and 0.55C/W respectively. “The top-exposed DFN 5×6 package shares the same footprint as AOS’ standard DFN 5×6 package, eliminating the need to modify existing PCB layouts,” said ...

CUI has introduced a range of ac fans with air flows 45 and 165CFM Across the 26 member CAF family there are three frame sizes – 120 x 120mm square either 26 or 38mm thick, and or 172mm circular (truncated to 150mm in one dimension) which is 51mm thick. Frames are aluminium, impeller is polymer (PBT, UL94V-0), and there is ...

Frore Systems is developing a thin flat device cooler that pumps an airflow without using a fan. Called AirJet, it comes in two versions: Mini 27.5 x 41.5 x 2.8mm Removes 5.25W from IC with 85°C die Consumes 1W 1750 Pascals pressure 0.21 CFM flow 21dBA sound output Pro 31.5 x 71.5 x 2.8mm Removes 10.5W from IC with 85°C ...

Chomerics is aiming its latest thermal interface gel at thin heatsink bonds. GEL 50TBL (TBL – thin bond line) offers 5W/m.K bulk thermal conductivity and, “at a minimum bond line thickness of 0.05mm, the apparent thermal conductivity exceeds 10W/m.K”, according to the company. However, “the material is primarily for thin bond lines and is not typically intended for use as ...

Chomerics has announced a thermal gap filler pad material with a conductivity of 8.3W/m.K and 40 Shore 00 hardness. “With the highest available thermal conductivity in its product family, ‘PAD 80’ maintains low compression forces and conformability between mating surfaces,” said Chomerics. “Very low compression force means the product will deflect under assembly pressure, minimising stress on components, soldered joints ...

Chomerics has unveiled a thermal interface gel aimed at high-throughput production. Called GEL 60HF (HF = high flow), long-term thermal stability is claimed by the company, as are properties suited to re-work and field repair. “The paste-like consistency enables tightly controlled dispensing and accurate material placement during assembly,” it said. “Notably, the product requires low compressive force to deflect under ...

Laird Thermal Systems has created a series of multi-stage thermo-electric coolers for miniature optical packages. MSX Series have cold-side footprints down to 2 x 4mm, and thicknesses down to 3.3mm for two stages, 3.8mm for three stages and 4.9mm for four-stage coolers. It has the “capability to integrate them into various optical packages, including TO-39, TO-46 or TO-8”, according to the ...

NXP has announced a family of top-side-cooled RF amplifiers, intended to shrink and lighten radios for 5G infrastructure – the company is claiming a reduction basestation thickness and weight of over 20% compared with those made with its bottom-side cooled amplifiers. It is aiming at active MIMO (multiple input multiple output) antenna arrays, where using a top-side cooled amplifier (‘PA’ ...