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SSDs with PCIe 5.0 spec

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Kioxia is now sampling select OEM customers with Enterprise and Data Center Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology. Features include: ● EDSFF E3.S form factor with capacities up to 7.68TB● Designed to the latest PCIe 5.0 specification and optimized for x2 PCIe lane performance● Using fewer PCIe lanes increases the number of PCIe devices that ...

DMASS reports leap in semiconductor distribution but warns of shortages

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The European components distribution market is feeling chipper today, as DMASS (European Semiconductor Distribution) reports a jump in sales of 31.8% in semiconductors in Q3 and 44.7% for interconnect, passive and electromechanical (IPE) components. DMASS reported Q3 distribution revenue for semiconductors of €2.46bn and €1.13bn for IPE distribution sales. The combined members of DMASS, covering nearly 80% of European components’ ...

Kioxia speeds and slims its 3D UFS flash memories

Kioxia BiCS flash

Kioxia is sampling its newest generation of 256 and 512Gbyte 3D flash memory. Aimed at mobile applications, its ‘universal flash storage’ (UFS) version 3.1  devices “improve performance by 30% for random read and 40% for random write, making them faster than their predecessors,” according to the company, which added that, at 0.8mm, the new 256Gbyte parts are thinner than their predecessors. ...

Infineon aims SRAM at space

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Infineon has announced its next-generation 144Mbit QDR-II+ (quad data rate II+) SRAM certified to QML-V. QML-V (DLA qualified manufacturers list class V) is the highest quality and reliability standard certification for aerospace-grade ICs., said the company. “This rad-hard QDR-II+ SRAM is a unique high-speed external cache memory, ideal for radar, on-board data processing and networking applications in space.” It is ...

High-rel industrial and aerospace RAM is non-volatile

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Infineon has announced a second-generation of its non-volatile static RAMs (nvSRAM). “The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support non-volatile code storage and data-logging in harsh environments, including aerospace and industrial applications,” according to the company. “Both 5V and 3V versions support boot code, data logging and calibration data storage for aerospace, communications ...

DDR5 in RDIMMs, UDIMMs and SODIMM start at 16Gbyte

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Smart Modular Technologies has launched a DDR5 module family. With a 4.8 to 6.4Gbit/s data rate, DDR5 provides twice the performance of DDR4, as well as improved power efficiency through an on-DIMM 12V voltage regulator and 1.1V I/O. With a dual-channel DIMM topology for higher channel efficiency, according to Smart, it is suited to cloud computing and enterprise networking. “As ...

Infineon extends franchise with Future to Europe

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Future Electronics is now franchised to sell Infineon products in Europe, after the semiconductor company extended its agreement beyond Asia and the Americas, covered in its previous agreement. The distributor is also franchised to supply products from Infineon’s subsidiary, Cypress Semiconductor worldwide. Future expects the Infineon portfolio of power, automotive, security, wireless semiconductors and microcontrollers to be used by customers ...

Symetrix to co-develop CeRAM with Cerfe Labs

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Symetrix announced today it will continue its development of CeRAM nonvolatile memories and other technologies in collaboration with Cerfe Labs, the recently formed ARM spin-out. CeRAM harnesses the quantum phase transition known to exist in carbon-doped transition metal oxide (TMO) materials, a transition that produces a huge change in resistance due to a voltage and current induced shift in the ...

Cerfe Labs spins out from Arm

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Arm has announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs). Arm CeRAM researchers will join Cerfe Labs and assume ownership of the Arm joint development project with Symetrix Corporation. As part of the spin-out, Arm will transfer its full CeRAM IP portfolio of ...

GDDR6 to overtake GDDR5 in Q4 driven by the Big 3 producers

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GDDR6 graphic DRAM will overtake GDDR5  in Q4 to account for more than 60% of total graphics DRAM bit output, says TrendForce. The lowered production capacity and high demand have resulted in a tight supply situation for GDDR5. Spot prices of GDDR5 8Gb chips are 10% higher than 3Q20 contract prices. Therefore, the supply of GDDR5 is expected to remain ...