The ‘Bell Swoosh’ will determine the pattern of the semiconductor industry recovery, according to Dave Bell, CEO of Intersil in a talk to the Globalpress Summit Conference in Santa Cruz today.
Analogue and Discretes
Linear Tech protects portables from defective PSUs
Linear Technology has introduced a front-end over-voltage and over-current protection chip that stops errant power supplies blowing up portable electronics. "Overvoltage events can occur due to power adapter failure or faults...
How to get static protection for hot-swap boards
Protection from electrostaic discharge in hot-swappable systems can be implemented both on and off the board, writes Richard Wilson To protect hot-swappable boards from electrostatic discharge, Rittal has come up with an electrostatic discharge (ESD) facility which is designed to remove all built-up charge from the front panel of the plug-in board and so brings the panel to protective earth potential. ...
Inductive flash LED driver drives up to 1000mA
The high-side current source from austriamicrosystems works with up to 2x500mA with two LEDs in serial configuration and up to 720mA with one LED
Intersil to buy in-car video chip firm for $370m
"The acquisition will significantly increase our overall industrial business, which will become our largest end market at approximately 31% of revenue," said Intersil CEO Dave Bell
Dual in the crown for op amps
Guest columnist Harry Holt, applications engineer at Analog Devices, believes that two into one is a relevant question when designs need more than one operational amplifier
‘Most accurate’ DAC aims for MRI scanners
Analog Devices has introduced industry's most accurate monolithic digital-to-analogue converter. Designed in Edinburgh, the AD5791 20bit DAC has 1ppm resolution and accuracy, sub 1ppm noise and 1µs refresh.
Need for efficiency stabilises audio amplifier chip design
Pushed by power efficiency requirements, integrated audio amplifier architectures are settling down, with Class-D at the top end and Class-AB at the bottom, leaving a little gap in the middle where Class-G is flourishing.
MEMS built in metalisation over CMOS
Accelerometers, compasses, gyros and RF switches can be made cheaply in the metal layers over CMOS , claims Barcelona-based Baolab Microsystems.
Maxim ASIG transceiver ups 3G basestion integration
The chip includes a transmitter, receiver, and active filters in a 3x3mm TQFN package. “This is x100 smaller than discrete designs,” said Maxim