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The Wireless Broadband Alliance (WBA) today published “Wi-Fi 6/6E for Industrial IoT. The paper can be downloaded here:  “Wi-Fi 6/6E for Industrial IoT: Enabling Wi-Fi Determinism in an IoT World.” Produced by the WBA’s Wi-Fi 6/6E for IIOT work group, led by Cisco, Deutsche Telekom and Intel the white paper provides an overview of Wi-Fi 6 and 6E capabilities suitable for ...

Omron has launched a PCB power relay that provides bi-directional high power DC switching for home renewable energy storage batteries and electric vehicles wall boxes – for example, in vehicle-to-home and vehicle-to-grid charger systems. “It will be particularly beneficial where electricity from solar panels is being used to charge an electric vehicle,” said Omron marketing manager Steve Drumm. Called G9KB, it is a single ...

Swave Photonics, the Imec spin-off specialising in Holographic eXtended Reality (HXR), has raised a €7 million seed round. The investment will be used to fund the commercialisation of  3D HXR gigapixel technology for a wide range of emerging applications. Swave Photonics is a spin-off of imec and Vrije Universiteit Brussel. Imec.xpand, a value-add venture capital fund focused on nanotechnology innovations, ...

Zap Energy, the Seattle fusion startup, has created the superheated plasma required for fusion and has raised $160 million from backers including Bill Gates. Zap has a technology to confine and compress plasma called sheared-flow-stabilized Z pinch which is claimed to be simpler than other approaches. “Z pinch has long been an appealing way to achieve nuclear fusion, but for many years ...

SiFive has  released the latest version of its SiFive Intelligence X280 processor, which introduces  new features including scalability up to a 16-core cache-coherent complex, WorldGuard trusted protection, and an interface allowing for integration between the X280 vector unit and customer-designed external AI accelerators or other coprocessors, called VCIX (Vector Coprocessor Interface eXtension). Collectively, these enhanced features deliver scalability, security, and interoperability to the ...

The Japanese government is to pay $3.5 billion to TSMC for building an $8.5 billion 55,000 wpm jv fab with Sony and Denso in Kumamoto. The 40% Kumamoto subsidy is in line with the support the Germany authorities are giving to Intel for its fab in Magdeburg. Intel will receive $7.3 billion in subsidies representing 40% of the $19 billion ...

Mike England (pictured) has two missions – the first to inform customers and investors that the company formerly known by the parent brand Electrocomponents is now RS Group; the second is to raise the company’s ambition levels and “take it from an average-to-good company to a great company,” he said. The streamlined, all-inclusive name reflects that components are not the ...

The US chip industry is getting increasingly edgy about the hold-up in getting the Chips Act implemented. Although both Houses of Congress passed separate versions of the bill in February, wranglings continue over reconciling the different versions and over where the $52 billion should be allocated , while some Congressmen are having doubts about the value of the whole project. ...

Toshiba and Japan Semiconductor have developed an analogue process with embedded non-volatile memory (eNVM) for automotive applications. The 0.13-micron process   applied to analogue ICs is claimed to offer an optimized combination of processes and devices, according to rated voltage, performance, reliability and cost, for automotive analogue circuits and eNVM on a single chip. Analogue ICs, including motor driver ICs, ...

Researchers at the University of Tokyo have grown a skin-like layered material from bio-materials found in human skin. The result, demonstrated on a robot finger, self-fits to the underlying structure, is flexible, soft to the touch, and shows some self-healing properties. A 3D printed three-jointed finger, later operated by nylon threads running through it, was used as a scaffold for ‘skin’ ...