Electronics Weekly Electronics Design & Components Tech News
The plan involves financial help from the new US administration which is said to be currently under negotiation.
The plan is to start building this year with manufacturing equipment to be installed in 2022 and first wafers to be run in 2023.
Samsung bought the land for the fab last year and applied to the local authority for planning permission.
Great timing … the fab will come on line right as the chip market enters the next cyclical downturn!
mpenn@futurehorizons.com