3D automated optical inspection down to 008004 (M0201) and up to 25mm tall

Saki Corporation has announced a series of high-speed 3D automated optical inspection systems for PCBs with a combination of very small and tall components.

Called the 3Di series, its newly-developed camera system can simultaneously inspect parts in 008004 packages (metric 0201, ~200 x 100μm) and 25mm tall parts.

The first 3Di machine will debut on 15-17 June at JISSO PROTEC in Tokyo, with a camera resolution of 8μm, height measurement up to 25mm and 4,500mm²/s imaging.

The company claims “an innovative inspection algorithm that enables clear 3D solder joint inspection” and “the option to easily modify configurations at any time as required by adding new camera heads, AI functions, and other future features”.

Find Saki on its own stand (4D-12 East Hall 4-6) at JISSO PROTEC as well as Panasonic’s (5D-29).