Tag Archives: Infineon Technologies

Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...

Infineon and Honda have signed an MoU  to  collaborate in power semiconductors, ADAS, and E/E architectures, where both parties will collaborate on new architecture concepts. Infineon will become Honda’s semiconductor partner to align future product and technology roadmaps. The two companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on ...

Infineon and GlobalFoundries have agreed a supply deal for Infineon’s AURIX TC3x 40nm automotive MCUs, PMICs and connectivity ICs. The additional capacity will help secure Infineon’s business growth from 2024 through 2030.   Infineon and GF have been partnering since 2013 in the development of differentiated automotive, industrial and security semiconductor technology and products. At the centre of this collaboration ...

Infineon has introduced a magnetic sensor for micron-level movement measurement. Called TLI5590-A6W, it has two TMR (tunnel magneto-resistance) Wheatstone bridges inside (see diagram), spaced 500μm apart so that they deliver sine and cosine voltages when moved relative to long magnets, or circular magnets, whose poles change every 500μm in the working direction. “Qualified for industrial and consumer applications to JEDEC ...

Infineon has put 650V mosfet die from its CFD7A portfolio into a surface-mount package with “improved electrical performance over the well-known TO247 through-hole devices, thus enabling efficient energy utilisation in onboard chargers and dc-dc converters”, it said. ‘QDPAK TSC’ is a top-side-cooled package (see images) announced earlier this year and now registered with JEDEC – at the same time it ...

Infineon has bought the Zurich-based UWB startup 3db Access (3db). 3db delivers secured, ultra-low power and high-precision integrated UWB ranging and sensing products which enable a broad range of applications including provable secured access to valuable assets (vehicles, buildings), secured proof of proximity for seamless mobile payments and real-time high accuracy and precision localisation of connected, intelligent devices. Infineon now ...

Infineon is aiming its latest mosfets at automotive ECUs (electronic control units) with 24 to 72V power rails. “In addition to passenger cars, two and three-wheelers as well as light vehicles are increasingly being electrified,” said the company. “To address this, Infineon is complementing its OptiMOS 5 portfolio of automotive mosfets in the 60 V and 120 V range with ...

Infineon Technologies is testing a biodegradable PCB material based on natural fibres in demo and evaluation boards. The substrate, branded Soluboard, is from UK start-up Jiva Materials, which claims that it would result in a 60% reduction in carbon emissions compared with FR-4, saving 10.5kg of carbon and 620g of plastic per square meter of PCB. Made from undisclosed natural fibres ...

Infineon Technologies has launched an ultra-low resistance high-side switch in a 9.9 x 11.7 x 2.3mm surface-mount package. For automotive use on 12V circuits, the IC is “ISO 26262-ready for supporting the integrator in evaluation of hardware element according to ISO 26262:2018 Clause 8-13”, said the company. Called BTS50005-1LUA, its nominal on-resistance is 0.6mΩ (1.1mΩ max at 150°C) and carrying ...

Infineon and Foxconn aim to establish a long-term partnership in EVs with an MoU focussing on SiC development. “The automotive industry is evolving. With the rapid growth of the EV market and the associated need for more range and performance, the development of electromobility must continue to advance and innovate,” said Peter Schiefer (pictured left) President of the Infineon Automotive ...