Home » 2014 » September

Monthly Archives: September 2014

Dual-configuration FPGAs from Altera

Altera has availability of non-volatile  MAX-10 FPGAs. Using TSMC’s 55nm embedded flash process technology, MAX 10 FPGAs deliver dual-configuration flash, analogue and embedded processing capabilities in a small-form-factor, low-cost, instant-on programmable logic device. The FPGAs, shipping today, are supported by Quartus II software, evaluation kits, design examples, documentation, training and design services. 

HP launches ARM-based Servers

HP  has brought out two ARM-based servers – the ProLiant M400 with a 2.4GHz ARMv8-based Applied Micro X-Gene eight-core SoC and M800 which has a 32-bit Texas Instruments quad-core 1GHz ARM Cortex-A15 with eight DSP cores.

Kyocera pushes HTCC packaging to 1000°C.

Alumina - High Temperature Co-fired Ceramic - HTCC

Kyocera’s ceramic packaging based on HTCC technology (High Temperature Co-Fired Ceramics), which is currently used with specific “non-magnetic” piece parts and plating options, is now being used to deliver an HTCC with platinum metallization on the top surface and in ceramic multilayering.

ARM and TSMC claim performance records

Big.Little_New

TSMC and ARM have today announced the results from a key FinFET silicon validation of the ARM big.LITTLE implementation, using ARM Cortex-A57 and Cortex-A53 processors on TSMC’s advanced 16nm FinFET process technology.

Internet Companies Invest In Physical Internet

A report by Analysys Mason commissioned by Google shows Internet companies like Facebook and Google invest over $30 billion per annum in physical networks, facilities and equipment, and have invested nearly $100 billion between 2011 and 2013.  The lion’s share of this ($30 billion over three years) goes to Europe.g