Home » Tag Archives: module

Tag Archives: module

10 x 20mm Bluetooth 5.0 module has 250m range

Infineon CYW20822-P4TAI040 Bluetooth5 module

Infineon has introduced a ~10 x 20mm antenna-inclusive Bluetooth 5.0 (core spec) module that consumes 1.3mA receiving (-95dBm) and 3mA transmitting (0dBm). Called CYW20822-P4TAI040, it sleeps at 2μA when retaining 32kbyte of ram, or hibernates at 800nA – the latter rising to 950nA hibernating with the wake-up receiver enabled. At maximum transmit power (+4dBm) up to 250m of range can be ...

LEM, Semikron Danfoss add current sensing to automotive power modules

Semikron Danfoss DCM SiC mosfet module

LEM and Semikron Danfoss have teamed up to monitor current in automotive silicon carbide power mosfet modules. The result is ‘Nano’, a current sensor that is compatible with Semikron’s DCM SiC power modules, which are rated at 750 or 1,200V and 200 to 1,000A. “The idea behind the Nano concept was to design a core-based current sensor that could fit ...

Raspberry Pi Compute Module 5 forward guidance available, to some

CM4 Raspberry Pi Compute Module 4 CM4

For those of you wanting to design with Raspberry Pi’s much-awaited Compute Module 5 (CM5), the organisation has created a forward guidance document to help engineers get started. Electronics Weekly cannot publish any of it here, but you can download the CM5 forward guidance document from this web page – a sign-in is needed for this – creating a Raspberry ...

Modular 600W medical psu on 3 x 5inch footprint

Vox Power NEVOplus600S 600W acdc psu

Vox Power has introduced a compact 600W modular ac-dc power supply with four output slots, and a choice of eight output modules that can be mixed and matched among them. NEVO+600S is the name, and it measures ~41 x 78 x 134mm (plus blade terminals), giving it a 5 x 3inch footprint. “Tailored for demanding industrial applications where size, power ...

Wireless MCU for Bluetooth 5.3 LE in chip-scale package

ST STM32WB09 bluetooth MCU

ST has announced a wireless microcontroller with the Bluetooth 5.3 LE software, initially in a 5 x 5mm QFN, and scheduled to be available in a ~2.8 x 3mm chip-scale package. STM32WB09 (right) is built around a single Arm Cortex-M0+ core and will support 2Mbit/s data, long range (coded PHY), advertising extensions, angle-of-arrival, angle-of-departure, LE data packet length extension and ...

LTE modules get EU’s RED cybersecurity certification

LARA-R6 LTE cybersecure wireless moduleu-blox

U-blox’ LARA-R6 LTE Cat 1 and LARA-L6 LTE Cat 4 cellular modules have been certified to Radio Equipment Directive (RED) cybersecurity, having passed RED article 3.3 d/e/f requirements using ETSI’s EN 303 645 standard. “As cyberattacks and privacy concerns grow, there’s an urgent need for wireless devices and products to feature enhanced security. With stricter regulations on the horizon, manufacturers ...

Renesas looks to buy 5G IoT chip company

Sequans GM02S-Monarch module

Renesas Electronics has signed a memorandum of understanding to acquire Sequans Communications, a developer and supplier of 5G and 4G IoT chips and modules. “Renesas will, following consultation of the Sequans’ works council and favourable recommendation by the Sequans Board, commence a tender offer to acquire all outstanding ordinary shares, including American depositary shares [ADS] of Sequans for $3.03 per ...

Wireless modules synchronise multiple TiePie scopes

TiePie WCMI module fitted

Dutch test gear maker TiePie Engineering has introduced a module that can wirelessly time-synchronise and remotely access multiple instances of its PC oscilloscopes. ‘Wireless multi instrument synchronization module’ WCMI-8 can synchronise series 5 and 6 of both the company’s WiFiScope and Handyscope instruments, at up to 400m range “combining them to a single instrument”, it said. The 868MHz module is ...