Conga-STDA4 is the first, a SMARC computer-on-module with TI’s industrial-grade TDA4VM processor, which has dual Cortex-A72 cores and is aimed at industrial mobile machinery requiring near-field analytics – automated guided vehicles, autonomous mobile robots, construction machinery and agricultural machinery, for example.
There are also six 1GHz Cortex-R5F cores on the IC, and up to 8Gbyte of ram on the board.
Dual Gbit Ethernet with IEEE 1588 support will be the primary comms interface.
“We see that autonomous driving based on AI and computer vision is one of the most important markets for embedded and edge computing technologies beside the second major growth accelerator digitisation,” said Congatec product director Martin Danzer.
First booting samples of STDA4 are scheduled for mid-2023, with series production scheduled for 2024.
The company will reveal more of its TI portfolio at its Embedded World 2023 stand – number 241 in hall 3.